Nand Flash
Project details
-
Date
04/05/2022
- Category
Memory chips supporting multiple wafers
Follow JEDEC JESD230C international standard, standard package 132/252-ball BGA, support 32GB~1TB capacity segment, and support the original mainstream wafer. It can package 1-16 wafers in one particle. Products are divided into single channel, double channels and four channels. Single channel and dual channel Nand is suitable for U disk and SSD; Four-channel Nand is suitable for M.2 2230 SSD product.
