Memory chips supporting multiple wafers Follow JEDEC JESD230C international standard, standard package 132/252-ball BGA, support 32GB~1TB capacity segment, and support the original mainstream wafer. It can package […]
Excellent performance and efficiency Compliance to JEDEC standard, it has lower working voltage, lower power consumption and more energy saving. It supports 8GB ~ 64GB capacity . LPDDR4 offers […]
Advanced technology, high integration and large capacity Compliance to JEDEC eMMC 5.0 / 5.1 standard, the eMMC interface, flash memory device and main controller are encapsulated in a […]